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NSE-5310
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 5 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
V IN VDD5V
V IN VDD3V3
VDD
V IN
V IN VDD3V3
I scr
ESD
T strg
T body
Parameter
DC Supply Voltage at pin VDD5V
DC Supply Voltage at pin VDD3V3
DC Supply Voltage
Input Pin Voltage
Input Pin Voltage VDD3V3
Input Current (latchup immunity)
Electrostatic Discharge
Storage Temperature (TSSOP)
Body temperature (Lead-free package)
Humidity non-condensing
Min
-0.3
-100
-55
5
Max
7
5
7
VDD+ 0.3
5
100
±2
125
260
85
Units
V
V
V
V
V
mA
kV
oC
oC
%
Comments
Except VDD3V3
Norm: Jedec 78
Norm: MIL 883 E method 3015
Norm: IPC/JEDEC J-STD-020.
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020C
“Moisture/Reflow Sensitivity Classification
for Non-Hermetic Solid State Surface
Mount Devices”.
R th
MSL
www.ams.com
Thermal Package Resistance
Moisture Sensitivity Level
114.5
3
Revision 1.5
oC/W
Represents a maximum floor time of 168h
4 - 22
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